Semiconductor packaging companies At last count, the semiconductor industry has developed around 1,000 package types. What is OSAT? OSAT stands for Outsourced Semiconductor Assembly and Test. From semiconductor fabrication and advanced packaging, to component packaging and manufacturing equipment support and maintenance, our goal is to improve product performance, process efficiency and yield, so you can move confidently into the future. 7 billion by 2033. Intel Corporation, Taiwan Semiconductor Manufacturing Company, Advanced Semiconductor Engineering, Inc, Samsung Electronics Co. Integrated semiconductor Device Manufacturer of SoC, microcomputers, ASIC, and discrete semiconductor devices, headquartered in Kawasaki, Kanagawa. The demand for semiconductor packaging solutions is expected to rise due to the widespread adoption of 5G smartphones with higher silicon contents. Oct 24, 2024 · The semiconductor industry is undergoing a profound shift in packaging technologies to ones that rely on close collaboration among multiple stakeholders to solve intricate, multi-faceted, and extraordinarily complex problems. SIMMTECH was found in Korea 1987, currently listed 2 companies in KOSDAQ. Choose us as your trusted partner for superior, reliable solutions in semiconductor Mar 5, 2025 · As we look ahead to 2025, the semiconductor packaging landscape is on the verge of transformation, driven by innovations in AI, automotive technology, and data center expansion. Since the invention of the first semiconductor package in 1965, the semiconductor packaging technology has grown dramatically and several thousands of different semiconductor package types have been made. , Taiwan Semiconductor Manufacturing Company Limited, Advanced Semiconductor Engineering Inc. As AI continues to push the need for larger substrates with more layers and I/Os, cutting-edge packaging Nov 12, 2024 · The South Korean company is investing about 1. These top 10 OSAT companies are at the forefront of innovation, driving advancements in semiconductor packaging and testing to meet the evolving needs of the electronics industry. Advanced packaging is revolutionizing semiconductor design and manufacturing, optimizing power, performance, and area (PPAC), while reducing costs. Advanced packaging is a general grouping of a variety of distinct techniques, including 2. Ltd and Powertech Technology Inc. The semiconductor industry is experiencing a surge in investment and expansion of advanced packaging facilities, driven by increasing demand for high-performance computing and other applications. 95 billion deal with Dec 13, 2024 · Traditional packaging technologies struggle to meet the needs of the AI era, creating an opportunity for advanced semiconductor packaging technologies to shine. Companies: PHONE: Web Links: Description: OX3 Corporation. Mordor Intelligence expert advisors conducted extensive research and identified these brands to be the leaders in the High-end Semiconductor Packaging industry. 10% from 2021 to 2030. This expansion is geographically diverse, with major projects underway in Taiwan Figure 1 – OSAT Offering by Application and by Types of Packaging . com; Headquarters: Princeton, New Jersey, United States Nov 7, 2022 · Currently, U. Oct 14, 2021 · Following the acquisition of the US company Cypress Semiconductor Corporation in April 2020, Infineon is now a global top 10 semiconductor company. Over One of the top suppliers of semiconductor packaging and testing services is ASE Technology Holding. Ltd and Siliconware Precision Industries Co. Particularly it shows the two major trends in semiconductor packaging: addressing high pin count and accommodating small footprint Panel-Level Packaging: SEMI 3D20 Clears the Path. Cherie Sasan, Head of Design and Development, Power Module Technology, Integrated Micro- Electronics. Jul 4, 2024 · In 2023, with an annual revenue of over 308 billion New Taiwan dollars, ASE Group was Taiwan's leading integrated circuit testing and packaging company. 4. Ltd and Amkor Technology Inc. While putting multiple chips in a package has been around for decades, the driver for advanced packaging is directly correlated with Moore’s Law. The process of putting together a semiconductor chip so that it can be connected to other components is known as semiconductor packaging. Amkor Technology, Inc. 3 trillion won ($930. Ltd, Amkor Technology, Jiangsu Changjiang Electronics Technology Co. 43 billion by 2030. is the world's largest US headquartered OSAT (outsourced semiconductor assembly and test) service provider. , but to add wafer-based processing like copper pillar Amkor Technology, Inc. Mar 5, 2025 · The company serves the semiconductor and compound semiconductor industries in developing solutions for the wireless, power device, MEMS, photonics, advanced packaging, and data storage markets. , and/or its affiliated companies. Jun 17, 2024 · ViTrox Technologies is a Malaysian semiconductor company specializing in automated vision inspection systems for the electronics industry. Source: iStockPhoto. Get access to the business profiles of top 10 Advanced Packaging companies, providing in-depth details on their company overview, key products and services, financials, recent developments and strategic Taiwan’s chip packaging and testing sector is among the biggest in the world, and including operations in China, performs back-end chip production for more companies than any other. 98 billion by 2030. S. It affects power, performance, and cost on a macro level, and the basic functionality of all chips on a micro level. 9. Mordor Intelligence expert advisors identify the Top 5 Advanced Packaging companies and the other top companies based on 2024 market position. Website: unitedsic. companies that are located overseas. They offer a wide range of products and services for industries such as aerospace, automotive, microelectronics, and more. Weili Dai, the Singapore company is capable of collaborating on everything from initial design to final manufacturing of chiplets through its established May 20, 2021 · “Several packaging approaches such as hybrid bonding, silicon interposer, or fan-out may be chosen, depending on the price and performance requirements. Nov 16, 2023 · Packaging companies are beginning to adopt leadless packages like TOLL or power CSPs, as well as surface mount devices in space-critical applications. As Sander The semiconductor equipment manufacturing industry is an integral part of the tech world. The packaging may be done by a separate vendor, the OSAT, although foundries are » read more That’s where 3M can help. Our goal is to enable our clients to compete more effectively by providing accurate, relevant, and timely information on technology trends and market developments. Get insights on key players, market strategies and learn about their market positions and contributions to the industry. 49 million) until 2026 to boost packaging operations for legacy memory chips, a company official based in South Korea said. These companies are pioneers in the development of packaging technologies and are setting the pace for innovations in the sector. , Suite 800 Beaverton, OR 97005 United States +1 503-673-3650 May 20, 2024 · For investors, strategic partners, and semiconductor companies, the message is clear: the time to invest in and prioritize advanced packaging is now. These companies offer packaging § More players are jumping on the advanced semiconductor packaging bandwagon as advanced packaging offers a higher-value opportunity than traditional back-end packaging. Since its founding in 1968, Amkor has pioneered the outsourcing of IC packaging and test services and is a strategic manufacturing partner for the world's leading semiconductor companies, foundries, and electronics Oct 23, 2024 · Global fabless semiconductor companies and foundries rely on their production and assembly facilities in East Asia and Southeast Asia to manufacture 73% of their chips and semiconductor equipment. On a consolidated basis, the Company’s 2018 full-year sales revenue were NT$ 87,417 million (USD 2. 5D & 3D Semiconductor Packaging Market is expected to reach USD 11. 4mm to 0. We are the semiconductor manufacturing service provider that specializes in development and production of thin substrates, IC packaging and chip-on-flex assembly. ASE Technology Holding Co. Aug 26, 2024 · The OSAT companies in 2024 remains dominated by a few key players who lead in technology, capacity, and market share. is a semiconductor product packaging and test services provider. BJ Han, Dr. The market is fragmented with the presence of a significant number of companies. About Us. Surana Telecom and Power Ltd: Founded in 1972, Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry. Another advanced packaging technique, panel-level packaging (PLP), moves semiconductor packaging to a large-panel format with promising potential to reduce cost by improving efficiency and economies of scale. Hyperion Technologies is a post-fab, system level manufacturing foundry. Azimuth Industrial Company Inc. Offering one of the largest packaging and test portfolios in the world, Carsem has three high-technology factories ensuring products meet the exact high-quality standards set by the automotive, power and consumer electronics industries. As such, there are many IC packaging companies in China that provide a wide range of services. , Ltd, SÜSS MICROTEC SE, Jiangsu The major companies in the Semiconductor Packaging Market are Changjiang Electronics Tech Co, IBM, Intel Corporation, Qualcomm Technologies, Inc. In electronic packaging, nearly 90 per cent of Integrated Circuits (ICs) are housed within plastic electronic packaging utilising underfill materials. This is where the US-JOINT consortium can contribute significantly with our leading technology in materials and equipment on Outsourced Semiconductor Assembly and Test (OSAT) Market Share, Size, Companies & Industry Growth (2025 - 2030) The Outsourced Semiconductor Assembly and Test Services (OSAT) Market Report is Segmented by Service (Packaging and Testing), Type of Packaging (Ball Grid Array Packaging, Chip-Scale Packaging, Stacked Die Packaging, Multi-Chip Packaging, and Quad Flat and Dual-Inline Packaging May 9, 2022 · SIMMTECH is a business group from Korea, focusing on developing and manufacturing semiconductor packaging substrates and high value printed circuit boards. They provide a comprehensive suite of packaging and test services, including wafer, bumping, wafer probing, wafer grinding, lead frame and substrate IC packaging, wafer level CSP, and RF, analog, digital, and mixed-signal testing. In this article, we will highlight the top 10 IC packaging companies in China, let’s take a look at who they are! How heterogenous packaging benefits from atmospheric argon plasma Semiconductor packaging plasma processing improves reliability and yield. TSMC advanced packaging services create the best solutions to unleash our customer's innovations by advancing the core technology, providing integrated turnkey services, and leveraging intelligent packaging fab. With more than 30,000 employees at 20 manufacturing locations in 11 countries, Amkor is a strong contributor to the development of the global semiconductor industry. The package protects the die, connects the chip to a board or other chips, and may dissipate heat. [5] The company's Arizona headquarters was originally in Chandler, [6] then later moved to Tempe. is a company dedicated to developing and innovating new technologies to provide customers with reliable, miniaturized, high-performance and cost-effective semiconductor packaging mass production service providers. Semiconductor packaging industry has been witnessing a significant number of new product launches, mergers & acquisitions, and expansions over the past few years. Apr 24, 2024 · The Korean company’s move is seen as a major win for the Biden administration which, alongside China, has recognised advanced packaging’s growing importance in the semiconductor supply chain. Company Description Semiconductor assembly and testing services are crucial for semiconductor manufacturing, with major companies investing heavily in equipment and processes. A list of Manufacturers that provide IC Packaging Services. Let our team of dedicated semiconductor logistics experts partner with you to achieve the perfect total solution. Mar 1, 2024 · When looking at the industry as a whole, Mainland China has around 38% of the global packaging market, the only part of the semiconductor value chain that it leads in, and three of the top ten companies globally. Advanced Packaging Assembly. 17% during the forecast period from 2024 to 2034. Revenue among Taiwan's Top 20 chip With increased demand, the need for innovative packaging solutions is rapidly growing. 63% to reach USD 47. 10 billion in 2020, growing at a CAGR of 9. From innovative materials to precision engineering, explore the bold steps shaping the future of electronics in this captivating journey of miniaturization. 44 billion by 2030 from $27. Companies in Taiwan and Singapore still control the more advanced technologies, but it’s less difficult Oct 25, 2024 · Outsourced Semiconductor Assembly and Test (OSAT) companies play a crucial role in semiconductor manufacturing by handling the packaging and testing of chips. Individual components are fabricated on semiconductor wafers (commonly silicon ) before being diced into die , tested, and packaged. Feb 1, 2018 · The company provides cutting-edge technologies in 4G, 5G radio frequency testing, and advanced semiconductor packaging & test services. com (510) 441-6000 He will explain why we package semiconductor die, describe the silicon to semiconductor package process flow, and how packaging is evolving to meet new market demands. 29, 2023-The South Korean industry ministry announced signing a MoU with Samsung Electronics, SK Hynix, and other chip firms to develop advanced semiconductor packaging. Their solutions are utilized in sectors such as Since the invention of the first ever semiconductor package in 1965, semiconductor packaging technology has grown dramatically, and several thousands of different semiconductor package types have been made. May 29, 2024 · As the semiconductor industry progresses toward advanced packaging methods, such as chiplets and 3D-ICs, a notable transformation is unfolding in back-end processes. Aug 14, 2023 · The company offers advanced packaging technology including fan-in and fan-out wafer level packaging, flip chip interconnect, 3D integration and Through Silicon Via (“TSV”). Nov 30, 2023 · Amkor Technology, Inc. 5mm 2 to 12. • Outsourced semiconductor assembly and test (OSAT): OSAT companies offer IC-packaging and test services for chip manufacturers. This has attracted many leading semiconductor companies to invest heavily in the field. Advanced packaging allows multiple devices, including electrical, mechanical, or semiconductor devices, to be merged and packaged as a single electronic device. The Semiconductor Packaging Market is expected to reach USD 104. Tim Olson founded Deca Technologies in 2009, after leading research and development at semiconductor company Amkor. 37 billion by 2030. Discover how cutting-edge advancements in semiconductor packaging are revolutionizing industries by enabling smaller, faster, and more efficient technologies. Semiconductor shipping, storage, distribution, and more. GlobalFoundries. May 10, 2017 · Packaging is an essential part of semiconductor manufacturing and design. How do we do it? The Advanced Packaging Market is expected to reach USD 34. ASE The 2. 91 billion by 2030. An autonomous vehicle that uses artificial intelligence is even more complex. May 24, 2023 · Second, packaging is mostly done by outsourced semiconductor assembly and test companies (OSATs) that compete largely based on low labor costs, rather than other sources of differentiation. East Asian countries such as Japan, South Korea, China and Taiwan have developed a mature chip ecosy ASE is the world’s leading provider of independent semiconductor manufacturing services in assembly and test. This model may change with the introduction of advanced packaging, which uses sophisticated technology and aggregates components from various wafers SJ Semiconductor Corporation specializes in producing 12-inch mid-end wafers and offers advanced packaging and testing services, including wafer-level packaging and multi-die integration processing. With locations in North America, Europe, and Asia-Pacific, Plasma-Therm meets the diverse needs of its customers with exceptional customer service. , Intel Corporation and JCET Group Co. Mordor Intelligence expert advisors conducted extensive research and identified these brands to be the leaders in the 3D IC Packaging industry. 72 results found See All Send Email to All The demand for semiconductor packaging solutions is expected to rise due to the widespread adoption of 5G smartphones with higher silicon contents. ASE Group, Amkor Technology Inc. Semiconductor packaging materials are a class of electronic solutions used to form the connection of the IC chip to the package substrate, another package or directly to the printed circuit board. The major companies in the Semiconductor Packaging Market are Amkor Technology, ASE Technology Holding Co. On this page you will find the latest news and information on all facets of semiconductor packaging. The High-end Semiconductor Packaging Market is expected to reach USD 42. . “There is interest across our U. 9mm. are the major companies operating in this market. Check the nine PACK4EU recommendations for Advanced Packaging in Europe Aug 2, 2024 · The packaging substrate is a circuit board used to carry chips. Hyperion specializes in high-density interconnect semiconductor substrates, semiconductor Interconnect Fabrics™, and microelectronic system level design and integration. (SPIL), a major global semiconductor packaging and testing company, celebrated a significant milestone today with the ground-breaking ceremony of its Malaysia P1 plant at Bandar Cassia Technology Park, Pulau Pinang. Suite 110 Union City, California 94587; Fax: (510) 441-6008; Email: questions@azimuthsemi. Apr 16, 2024 · Novel Epoxy Composites Used for Semiconductor Packaging. In June 2005, Suzhou Jingfang Semiconductor Technology Co. This report lists the top High-end Semiconductor Packaging companies based on the 2023 & 2024 market share reports. One of the keys to its future is advanced packaging, which is seen as vital to continuing the steady march of computing power, key to the era of high performance computing (HPC). Dec 25, 2024, 5:45 AM the largest outsourced semiconductor assembly and test company based in the U. We have listed the leading Semiconductor companies from around the world and made them searchable by their location and capabilities - Technologies, Materials etc. , Ltd. , has an estimated $44. Semiconductor packaging materials are a class of electronic solutions used to form the connection of IC chips to the package substrate. Moving forward, we expect advanced packaging solutions to play an increasingly important role in enabling future semiconductor innovations. With a history of innovating for more than 30 years, our team offers extensive knowledge and expertise to fully support cutting-edge projects and design innovative technology that will give you a competitive edge in your market. The government and chipmakers agreed to secure leading technologies in advanced semiconductor packaging and nurture companies in the final steps of semiconductor ASE is the world’s leading provider of independent semiconductor manufacturing services in assembly and test. For all semiconductor companies, advanced packaging technology is responding to the direct impact of big trends such as 5G, artificial intelligence and the Internet of Things. Apr 3, 2024 · Today’s news solidifies Indiana as a semiconductor industry leader. 16 billion in 2025 and grow at a CAGR of 7. Jan 29, 2025 · SE: What do these changes mean for how we go about packaging? Is there any standardization? Will there be assembly design kits that are workable for a long period of time. Mar 7, 2024 · Intense Competition in the Semiconductor Packaging Market: Focus on Advanced Packaging. OSAT companies offer a cost-effective way for semiconductor firms to outsource the packaging and testing process, allowing them to focus on chip design and fabrication. Recently, Broadcom announced new advancements in advanced packaging technology. Jul 22, 2023 · Silicon Box is an advanced chiplet interconnection company specialising in cutting-edge advanced semiconductor packaging. Quick-turn component taping available. Offers one of Industry’s widest range of packages in QFN with the footprint options from 0. The package is the container that holds the semiconductor die. Taiwan Semiconductor Manufacturing Company, Samsung, and SK Hynix are some of the largest and most advanced semiconductor companies located in the Asia Pacific region. It belongs to a technical branch of PCB and the core semiconductor packaging and testing material. The company, which has offices in Chennai, was acquired in 2014 by Singapore-based semiconductor packaging and design company Natronix. These materials are critical to semiconductor wafer-level packaging processes, heterogeneous integration, and 3D integration technologies. That growth rate is sufficient to produce strong returns for investors. NEC Semiconductors. The EU has responded and is promoting the expansion of corresponding infrastructures in Europe with the European Chips Act. The structure of the course and the step-by-step process is designed to ensure learner success. He will also introduce the concept of heterogeneous integration, which enables higher functionality by combining different types of devices in a single package. If you think there is a company that deserves to be on our upcoming prestigious annual list of Top 10 Semiconductor Packaging Solutions Companies , please write to us about them and the reasons you think they need to be on the list Jan 5, 2022 · “Semiconductor packaging is an integral part of the semiconductor supply chain,” said Kevin Engel, vice president of the FlipChip/Wafer Services Business unit at Amkor. 20% to reach USD 25. UnitedSiC is now Qorvo. 30593 Union City Blvd. Feb 19, 2025 · Experts at the Table: Semiconductor Engineering sat down to discuss 3D-IC progress and issues, photonics, and tradeoffs with different interposers and bridge technologies, with Michael Kelly, vice president of Chiplets and FCBGA Integration at Amkor; William Chen, fellow at ASE; Dick Otte, CEO of Promex Industries; and Sander Roosendaal, R&D director at Synopsys Photonics Solutions. 30 years experience. Global Daewon Daewon is currently serving 250 customers in 25 countries and is continuously investing in research and development, equipment, and facilities in support of the global IC semiconductor packaging and related industries. Sehat Sutardja, and Ms. ICleviathan is an multi national IC supply chain company. Explore the top companies and key players in the Advanced Semiconductor Packaging Market with our detailed report. The Microchip Advanced Packaging Services site is located in Caldicot, South Wales, UK. Headquartered in Singapore, ASMPT’s offerings encompass the semiconductor assembly & packaging, and SMT (surface mount technology) industries, ranging from wafer deposition, to the various solutions that organise, assemble and package delicate electronic components into a vast range of end-user devices, which include electronics, mobile Nov 12, 2024 · Even local companies are getting in on the semiconductor action, with FPT, one of the largest Vietnamese IT companies, building a 1,000-square-meter, $30-million testing factory with ten testing IBM develops chiplet and advanced packaging technology capabilities to supercharge innovations for AI and logic. has grown to become a world-class supplier in the semiconductor industry, providing the highest quality packaging and test services. sanctions and the Mar 5, 2025 · Advanced Packaging Outlook Report Unveiling the Next Generation of Semiconductor Packaging. Daewon was destined to become known as a semiconductor injection molding company with uncompromising quality. Low and high volume electronic component packaging. One stop shop for backend wafer WLCSP processing. American Semiconductor (ASI) thin-device capability is based on Semiconductor-on-Polymer™ packaging that makes the thinnest devices and semiconductor substrates possible. Chip manufacturers can rely on plasma processes to enhance applications. (TSMC) was founded in 1987 by Chung Mou Chang with its headquarters in Hsinchu, Taiwan. Major semiconductor packaging companies like ASE, Amkor Technology, Powertech, and Huatian Technology are continuously enhancing their competitive edge through expansions and acquisitions, driving rapid growth in the semiconductor packaging industry. Ltd are the major companies operating in this market. This sector is populated by companies that engineer solutions to facilitate the production of semiconductors, microscopic inventions that control electrical currents and are vital to modern electronics. World leader in tape and reel. The global semiconductor packaging market size is expected to reach $60. They provide advanced inspection solutions for semiconductor packaging, printed circuit boards, and surface mount technology. Packaging is an essential part of semiconductor manufacturing and design. ” Chiplets aren’t required for all chip designs. At the heart of this change is the convergence of heterogeneous integration, chiplets, and 3D stacking. is committed to conduct its business in an ethical and principled manner. 5% between 2023 and 2033, totaling around USD 53. The focus includes mapping existing facilities, evaluating technological capabilities, and identifying areas for improvement. 05% to reach USD 146. 10% to reach USD 85. Precision component taping and packaging. 2% annually between 2023 and 2032. 6 billion in 2023. The chart below presents the semiconductor packaging history. To serve the diverse needs of our world-class semiconductor manufacturers, Amkor offers more than 3000 different package formats and sizes. Leading-edge foundries are also expanding their packaging efforts. , ASE Group, and Siliconware Precision Industries Advanced packaging [1] is the aggregation and interconnection of components before traditional integrated circuit packaging where a single die is packaged. 5D, 3D-IC, fan-out wafer-level packaging and system-in-package. The global 3D semiconductor packaging market size was valued at US$ 11. Apr 24, 2019 · Siliconware Precision Industries (SPIL) is a semiconductor packaging and testing services company, based in Taichung, Taiwan. Stats Chippac also provides wafer probe and final testing on a diverse selection of test platforms used in semiconductors for mixed-signal, radio frequency, analog and Feb 6, 2024 · Today, Chinese companies are already responsible for 38% of the chip packaging worldwide. 800-264-2646 OX3 Semiconductor Packaging: OX3 Semiconductor Handling Services: YOUR COMPANY: 800-YOUR-COMPANY. Founded in 2021 by Dr. com This report lists the top 3D IC Packaging companies based on the 2023 & 2024 market share reports. According to a report on Sept. As such, it recognizes its responsibility to respect human rights and not contribute to conflict. Otte: In the AI area, these things are sort of back to the early days of the semiconductor industry, where the semiconductor companies were vertically integrated. Jul 8, 2024 · “In recent years, major semiconductor manufacturers and fabless companies in Silicon Valley, including GAFAM* 2, are designing semiconductors in-house and creating new concepts in back-end packaging one after another. We are recognized around the world as a leading consulting company in the field of advanced semiconductor packaging technology. For example, Apple, which has a major chip design operation in the U. Link $200/yr. At its core, semiconductor manufacturing involves two main stages: front-end processes, (wafer fabrication) and back-end processes (packaging and test). With the current focus on battery electric vehicles, and clean energy like solar and wind, the need for reliable power supply and conversion is expected to rapidly grow. Dec 28, 2023 · MIC Electronics, a company specialising in semiconductor packaging and testing solutions, is in line with the expansion of the semiconductor manufacturing sector in India. You may remember us as Quik-Pak, founded in 1992 and acquired by Promex Industries in 2015. 19 billion by 2034, upsurging at a CAGR of 16. China’s semiconductor industry has been growing rapidly in recent years, and IC packaging is an important segment of this industry. A semiconductor package is a Amkor Technology is a market leader in outsourced semiconductor packaging and testing. Rapidly Moving Market of Semiconductor Packaging . A semiconductor package is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits. The company is well-positioned to fulfil the growing demand for semiconductor solutions because of its strong national presence. 80 billion in 2025 and grow at a CAGR of 6. Feb 11, 2025 · TSMC (Largest Semiconductor Company in Taiwan) Taiwan Semiconductor Manufacturing Co. Challenges Facing Malaysia's Semiconductor Industry Our comprehensive services cover every step of the IC packaging process, ensuring high-quality results tailored to your specific requirements. From die-attach adhesives to liquid and film encapsulants, conductive coatings for EMI shieldings, first-level underfills such as liquid and film, to thermal interface materials and Mar 6, 2025 · Companies worldwide are investing in next-generation packaging solutions to meet the increasing demands of modern semiconductor applications. By bringing multiple technologies together at the package level to increase performance and reduce cost, our frameworks enable a new paradigm for semiconductor innovations as well as a new pathway to meet AI’s increasing performance demands. This state-of-the-art 8-hectare facility represents a substantial investment of RM6 billion. These packages serve as a bridge between the tiny, sensitive semiconductor chips and the broader electronic systems, providing electrical connections, thermal The packaging may be developed by separate providers, the Outsourced Semiconductor Assembly and Test (OSAT) companies. These materials typically consist of an epoxy matrix combined with high levels of silica and boast a low coefficient of thermal expansion Semiconductor Packaging Master Plan for Europe”, addressing investments, pilot lines, competence centers and further coordination actions dedicated to semiconductor packaging and the EU green deal. Our customer base includes, start-ups, system companies and Defence companies. The company has been headquartered in Arizona, since 2005, when it was moved from West Chester, Pennsylvania, also in the United States. This shift involves the adoption and adaptation of methodologies traditionally linked with front-end semiconductor manufacturing. 2% Find here ic packaging, semiconductor packaging companies, ic packaging companies, packaging design companies, semiconductor assembly, IC package design and ic packaging design services. The testing of semiconductors service is catered to medical, military, and communications industries. Wires are shrinking along with transistors, and the amount of distance that » read more Feb 20, 2025 · The semiconductor industry is a hallmark of technological innovation, evolving rapidly to meet the demands of an increasingly digital world. Address: Free Industrial Zone, Phase 2, Bayan Lepas Industrial Park, 11900 Bayan Lepas, Penang, Malaysia Jul 31, 2024 · The highest-revenue semiconductor companies produce a wide range of products, including microprocessors, memory chips, commodity integrated circuits, and complex systems on a chip. , Ltd, Siliconware Precision Industries Co. Semiconductor packaging technology is expected to increase the value of a semiconductor product by adding functionality in its The company also assembles semiconductor components and does semiconductor testing and packaging components. Since 2022, eight companies have announced plans to establish semiconductor manufacturing plants here, committing to invest more than $6 billion and create more than 2,100 new high-skilled, high-paying jobs for Hoosiers. JCET Group is a leading global semiconductor system integration packaging and test provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world. Oct 15, 2022 · With the continuous expansion of the scale of advanced packaging, the proportion has gradually approached and surpassed the trend of traditional packaging. Our company specializes in the management of customers’ IC operations throughout the entire IC flow cycle. 6% sequential growth compared with the same period of the year 2017. Their role comes into play at the end stage of the semiconductor manufacturing process following wafer and IC-substrate fabrication. semiconductor firms offshore nearly all packaging processes to OSAT companies or rely on IDM facilities owned by U. Apr 19, 2024 · A smartphone combines different packaging for the graphics, the user interface and the power management. Ltd (JCET), Siliconware Precision Industries Co. 47 billion in 2025 and grow at a CAGR of 17. , Intel Corporation, Samsung Electronics Co. SIMMTECH’s sales revenue recorded more than MYR 4 billion last year with around 4,000 employees around the world. Sep 7, 2023 · As semiconductor manufacturing processes become more advanced, both domestic and international companies are fiercely competing to dominate the packaging market. We place a strong emphasis on quality and precision, delivering dependable IC packaging and assembly services. This is a third-party service that suppliers around the world offer, which consists, as the name implies, of semiconductor assembly, packaging and testing of ICs (Integrated Circuits). For the semiconductor industry, packaging and testing is no longer just a separate foundry link in the past, but an integrated solution that combines design, material and equipment. Top 24 semiconductor companies in New York 1. The process of confirming that a semiconductor chip is operating as intended is known as semiconductor Feb 8, 2024 · The company provides package design, assembly and wafer sorting to integrated device manufacturers and fabless semiconductor companies. 00 billion in 2023 and is projected to hit US$ 57. One way to segment the packaging market is by interconnect type, which includes wirebond, flip-chip, wafer-level packaging (WLP), and through-silicon vias (TSVs). High-frequency applications, bolsters the overall scope for semiconductor packaging market, which is projected to grow at a CAGR of 6. Many of the world's most successful electronics firms rely on Unisem for semiconductor assembly and test (OSAT) services. The top companies in 3D semiconductor packaging are International Business Machines Corporation, Suss Microtec AG, Intel Corporation, Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor Chip Packaging Technologies Market Analysis The global Chip Packaging market was valued at US$ 32050 million in 2022 and is projected to reach US$ 48900 million by 2029, at a CAGR of 6. customer base to not only increase front-end semiconductor fabrication in the U. Jun 25, 2024 · ViTrox Technologies is a Malaysian semiconductor company specializing in automated vision inspection systems for the electronics industry. Semiconductor packaging is a crucial aspect of electronics manufacturing that involves enclosing semiconductor chips in protective and functional packages to ensure their reliability, performance and integration into electronic devices. This edition of Semiconductor Review brings the spotlight on the key advancements in the semiconductor packaging space and how companies leverage them to augment their manufacturing techniques. Integra Technologies offers a one-stop solution for all phases of the semiconductor manufacturing process, from die preparation, packaging and assembly to testing and beyond. 6 by global market research firm Fairfield, the semiconductor packaging market is expected to grow by more than 10% annually, reaching an estimated size 3D Semiconductor Packaging Key Players and their Developments. The global semiconductor packaging market size is expected to be valued at USD 28. is one of the world’s largest providers of outsourced (OSAT) semiconductor packaging, design, and test services. Packages range from traditional leadframe ICs for through-hole and surface mounting, to those required in high pin count and high-density applications such as Stacked Die , wafer level , MEMS , Optical Key Semiconductor Packaging Company Insights . 0mm 2 and thickness options from 0. § Advanced semiconductor packaging technologies are expected to account for 58% of the semiconductor packaging market by 2028, up from 47% in 2022. Leading semiconductor companies worldwide 2025, by market cap Revenue of leading semiconductor material companies in China Q1 2024-Q3 2024 Revenue of leading silicon wafer OEMs in China 2023 Dec 2, 2021 · The Semiconductor packaging process is a standout amongst the most emergent and astoundingly approved sectors. Surfx Technologies Innovative Solutions in Semiconductor Packaging. , STMicroelectronics, Taiwan Aug. Those that do will thrive, steering the semiconductor industry towards its next performance frontier and into a future marked by ingenuity, speed, and sustained growth. This has been worked on by a consortium gathering all relevant industry associations including the scientific Megatech is a company that specializes in supplying semiconductor equipment, thin film consumables, and specialty packaging. Learners will complete assessments based on industry experiences, which will serve as a basis for learners to effectively demonstrate the application of semiconductor packaging methodology. Several key players are significantly expanding their capacity, aiming for substantial production increases by 2025. Our facilities and personnel are 100% based in the United States. Semiconductor Directory is the largest database of Semiconductor Companies on the internet. Advanced packaging occupies 45% of the market share. Jun 26, 2023 · SMIC, a partially state-owned enterprise and the largest semiconductor manufacturer in China, is urging other Chinese companies to embrace advanced packaging to increase semiconductor processing power. Jan 31, 2022 · IC packaging itself is a complicated market. Besides, it also provides electrical connection and physical support Dec 25, 2024 · $407 million CHIPS Act package finalized for Arizona semiconductor packaging company. May 24, 2024 · Pulau Pinang, Malaysia, 24 May 2024 – Siliconware Precision Industries Co. Website: gf. Our unique assembly process designs enable you to achieve high-level, customized results with IC packaging solutions tailor-made to your specific applications. ASE develops and offers complete turnkey solutions covering IC packaging, design and production of interconnect materials, front-end engineering test, wafer probing and final test. Apr 5, 2024 · Yet, the chip packaging Market is expected to grow by 9. The company’s operational base includes production facilities, product development centres, and sales and support offices located in key electronics manufacturing regions in Asia, Europe, and the USA. The mission-critical semiconductor components made by the company deliver failure-free performance and are used in Hi-Rel applications. TechInsights' Advanced Packaging Outlook Report provides an in-depth analysis of the upcoming trends and market dynamics set to shape the future of advanced packaging. Today, QP Technologies is a leading provider of microelectronic packaging and assembly, wafer preparation, and substrate design and development services. 79 billion), representing 4. These companies see investment in advanced packaging capabilities as a means to increase semiconductor power despite both U. 9640 SW Sunshine Ct. Vision AOI inspection and electrical test. SPEL’s Packaging Portfolio broadly classified into Leaded (Through hole & SMD) packages and QFN packages. Established in 2005. Our subscribers nominate the companies with whom they have collaborated and gotten results. com; Headquarters: Malta, New York, United States; Founded: 2009; Headcount: 10001+ Latest funding type: Ipo; LinkedIn; GlobalFoundries (GF) is a semiconductor manufacturing company that specializes in power conversion, motor control, and chip production. Ultimately, the project seeks to inform strategic decisions aligning with the semiconductor industry’s dynamic requirements. Our customers are no longer bound by a specific design process dictated by individual fabricators or semiconductor packaging companies. We provide our customers with total supply chain solutions that encompass everything from semiconductor shipping to packaging to warehousing and distribution. 53 billion in 2025 and grow at a CAGR of 15. The growth in demand for high-tech, research-driven packaging solutions develops the consumer base for the semiconductor assembly and testing services industry across multiple sectors. Ltd (SPIL) are the major companies operating in this market. Jan 2, 2025 · 3D Semiconductor Packaging Market Companies and Regional Insights. Characterized by high density, high precision, high performance, miniaturization and thinness, it can provide support, heat dissipation and protection for chips. euynfy ldoxrdvxe vporcx azxr evf uitz kbebuv kfgkv sbjrn gyprusl fym cwh fdos iqiijby npzoo